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Features and Benefits
  Highest Performing Locite PCTIM
  Thermal Conductivity is 3.4 W/m-k
  No Substrate = Min. Bondline Thickness
  Phase Change = 45°C
  Can be Cut to Shape
Applications - Computer CPU, GPU Memory and IGBT/Ppwer Modules
Features and Benefits
  Low Thermal Impedance
  Excellent Long-Term Reliability
  Most Standard Packages Already Tooled
  Phase Change = 60°C
  Can be Cut to Almost any Shape
Applications - Power modules, resisters, relays, transistors, FET’s, etc.
Features and Benefits
  Premium dielectric material available
  Excellent Long-Term Reliability
  Most Standard Packages Already Tooled
  Phase Change = 60°C
  Can be Cut to Almost any Shape
  High Cut-through Resistance
  High Dielectric Strength (4500 V/mil)
Applications - Same as Thermstrate but where electrical isolation is required
Features and Benefits
  Excellent dielectric material
  Excellent Long-Term Reliability
  Most Standard Packages Already Tooled
  Phase Change = 60°C
  Can be Cut to Almost any Shape
  High Cut-through Resistance
  High Dielectric Strength (4500 V/mil)
Applications - Same as Isostrate but where a Lower Cost Solution is Required
Features and Benefits
  Soft Compressible Pad
  High Temperature
  Good Cut-through (fiberglass reinforced)
  Good Dielectric Strength (>900 v/mil)
Applications - Same as Isostrate but where conformability is required
Features and Benefits
  Low Thermal Impedance
  Volume Resistivity = 2 ohm-cm
  Phase Change = 60°C
Applications - Same as Thermstrate but where electrical conductivity is required
Features and Benefits
  Same As PowerstrateXtreme
  Can be Stencil Printed (enclosed head)
    Like a Paste
  Can be Applied Thicker or Thinner than
    PowerstrateXtreme
  Once Applied, Over Time the Solvents will
    Flash leaving a Dry Coating of Phase
    Change Compound
Applications - Same as PowerstrateXtreme but where Automation is Required and/or a Thinner/Thicker Coating. Also LED!
Features and Benefits
  Non-Silicone
  Water Cleanable
  Small Particle size = Thin Bondline
  Can be Stencil Printed Even on Open
    Head Systems
  Higher Performance vs. Dow DC340
  Lowest Cost Loctite Thermal Solution
Applications - Same as Thermstrate but where Paste Automation and/or a Lower Cost Solution is Required
Features and Benefits
  Can Reflect Radiated Heat Away
  Resists Some Conductive Heat
  Small Particle size = Thin Bondline
  Doesn’t need to Come in Contact with
    Heat Generating Device
  Adhesive Backing (PSA)
  High Temperature
Applications - Notebook Computers, Handheld Devices, Electronic Enclosures, Automotive, etc.